Semicondcutor devices, semicondcutor packages and methods of forming the same

A semiconductor package, comprising:

• a first die, comprising a connector thereon;
• a dielectric layer, over the first die and aside the connector, comprising a dielectric material and an additive, wherein the additive comprises a compound represented by the following Chemical Formula 1:
• in Chemical Formula 1,
• R is hydrogen, a hydroxyl group, a halogen group, a C1-C6 alkyl group, a carboxyl group, a vinyl group, an allyl group, a phenyl group, —OR′, —COR″, —CONR″, —COOR″, —CH2—CR″C═CR″2 or —SiR″3, wherein
• R′ is a C1-C6 alkyl group or a group represented by the following Chemical Formula 2 or the following Chemical Formula 3:
• in Chemical Formula 2,
• R2 and R3 are hydrogen, and R1 is hydrogen, a hydroxyl group, a halogen group, a C1-C6 alkyl group, a C1-C6 alkoxy group, a carboxyl group, a vinyl group, an allyl group, a phenyl group, —COR″, —CONR″, —COOR″, —CH2—CR″C═CR″2, —SiR″3,
• or
• R1 and R2 are hydrogen, and R3 is a hydroxyl group, a halogen group, a C1-C6 alkyl group, a C1-C6 alkoxy group, a carboxyl group, a vinyl group, an allyl group, a phenyl group, —COR″, —CONR″, —COOR″, —CH2—CR″C═CR″2 or —SiR″3;
• in Chemical Formula 3,
• one of R4 and R5 is hydrogen, and the other of R4 and R5 is hydrogen, a hydroxyl group, a halogen group, a C1-C6 alkyl group, a C1-C6 alkoxy group, a carboxyl group, a vinyl group, an allyl group, a phenyl group, —COR″, —CONR″, —COOR″, —CH2—CR″C═CR″2 or —SiR″3;
• and
• R″ is a halogen group, a C1-C6 alkyl group, a vinyl group, an allyl group or a phenyl group;
• and
• an encapsulant, encapsulating the first die and the dielectric layer;
• and
• a redistribution layer, over the dielectric layer and the connector and electrically connected to the first die through the connector.

A method of forming a semiconductor package, comprising:

• providing a first die having a connector thereon;
• forming a dielectric layer on the first die to cover the connector, wherein the dielectric layer comprises a dielectric material and an additive, and the additive comprises a compound represented by the following Chemical Formula 1:
• in Chemical Formula 1,
• R is hydrogen, a hydroxyl group, a halogen group, a C1-C6 alkyl group, a carboxyl group, a vinyl group, an allyl group, a phenyl group, —OR′, —COR″, —CONR″, —COOR″, —CH2—CR″C═CR″2 or —SiR″3, wherein
• R′ is a C1-C6 alkyl group or a group represented by the following Chemical Formula 2 or the following Chemical Formula 3:
• in Chemical Formula 2,
• R2 and R3 are hydrogen, and R1 is hydrogen, a hydroxyl group, a halogen group, a C1-C6 alkyl group, a C1-C6 alkoxy group, a carboxyl group, a vinyl group, an allyl group, a phenyl group, —COR″, —CONR″, —COOR″, —CH2—CR″C═CR″2, —SiR″3,
• or
• R1 and R2 are hydrogen, and R3 is a hydroxyl group, a halogen group, a C1-C6 alkyl group, a C1-C6 alkoxy group, a carboxyl group, a vinyl group, an allyl group, a phenyl group, —COR″, —CONR″, —COOR″, —CH2—CR″C═CR″2 or —SiR″3;
• in Chemical Formula 3,
• one of R4 and R5 is hydrogen, and the other of R4 and R5 is hydrogen, a hydroxyl group, a halogen group, a C1-C6 alkyl group, a C1-C6 alkoxy group, a carboxyl group, a vinyl group, an allyl group, a phenyl group, —COR″, —CONR″, —COOR″, —CH2—CR″C═CR″2 or —SiR″3;
• and
• R″ is a halogen group, a C1-C6 alkyl group, a vinyl group, an allyl group or a phenyl group;
• bonding the first die onto a first redistribution layer over a carrier;
• forming an encapsulant over the first redistribution layer to encapsulate the first die and the dielectric layer;
• removing a portion of the encapsulant to expose the connector;
• forming a second redistribution layer over the first die to electrically connect to the connector;
• forming a terminal connector over the second redistribution layer;
• and
• removing the carrier.