Redistribution substrate, method of fabricating the same, and semiconductor package including the same

A redistribution substrate comprising:

• a first conductive pattern;
• a first via connected to a first top surface of the first conductive pattern;
• a second conductive pattern on the first via, the second conductive pattern including:
• a second conductive pattern pad connected to the first via, and
• a plurality of connection lines spaced apart from the second conductive pattern pad;
• a second via connected to a second top surface of the second conductive pattern pad;
• and
• an under bump pad on the second via,
• wherein a first angle between a first lateral surface of the first via and the first top surface of the first conductive pattern is greater than a second angle between a second lateral surface of the second via and the second top surface of the second conductive pattern pad.

A semiconductor package comprising:

• a first conductive pattern and a second conductive pattern that are vertically spaced apart from each other in a dielectric layer;
• a plurality of first vias that connect the first conductive pattern and the second conductive pattern to each other;
• a plurality of second vias on the second conductive pattern;
• a plurality of under bump pads on the dielectric layer and connected to the plurality of second vias, respectively;
• and
• a semiconductor chip mounted on the plurality of under bump pads,
• wherein each of the plurality of first vias has a pillar shape whose first via width is uniform, and
• wherein each of the plurality of second vias has a tapered shape whose second via width increases with increasing distance from the second conductive pattern.

A redistribution substrate comprising:

• a first connection line layer comprising a first pad, and a first via connected to a top surface of the first pad, the first via having a uniform width;
• a second connection line layer comprising a second pad connected to a top surface of the first via, a plurality of connection lines spaced apart from the second pad, and a second via connected to a top surface of the second pad, a second via width of the second via increasing as a distance from the second pad increases;
• and
• an under bump pad on the second via.