Semiconductor structure, package structure, and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Ting Chen, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang
Life of this patent
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Abstract
A semiconductor structure including at least one integrated circuit component is provided. The at least one integrated circuit component includes a first semiconductor substrate and a second semiconductor substrate electrically coupled to the first semiconductor substrate, wherein the first semiconductor substrate and the second semiconductor substrate are bonded through a first hybrid bonding interface, and at least one of the first semiconductor substrate or the second semiconductor substrate includes at least one first embedded capacitor.
Claims20
A semiconductor structure, comprising:
- at least one integrated circuit component, comprising:
- a first semiconductor substrate and a second semiconductor substrate electrically coupled to the first semiconductor substrate, wherein the first semiconductor substrate and the second semiconductor substrate are bonded through a first hybrid bonding interface, and at least one of the first semiconductor substrate or the second semiconductor substrate comprises at least one first embedded capacitor.
A package structure, comprising:
- at least one integrated circuit component, comprising:
- a first semiconductor substrate having at least one first active device therein;
- and
- a second semiconductor substrate having at least one first capacitor embedded therein, electrically coupled to the first semiconductor substrate,
- wherein the first semiconductor substrate and the second semiconductor substrate are bonded through a first hybrid bonding interface;
- an insulating encapsulation, encapsulating the at least one integrated circuit component;
- and
- a redistribution structure, located on the insulating encapsulation and electrically coupled to the at least one integrated circuit component.
A manufacturing method of a semiconductor structure, comprising:
- forming at least one integrated circuit component, comprising:
- providing a first semiconductor substrate and a second semiconductor substrate, wherein at least one of the first semiconductor substrate and the second semiconductor substrate comprises at least one first embedded capacitor;
- and
- performing a first fusion bonding step to bonding the first semiconductor substrate and the second semiconductor substrate for electrically connection thereof.
Dependencies are inferred from the claim text.