Semiconductor Oxide or Glass Based Connection Body with Wiring Structure

A semiconductor device, comprising

• a chip carrier comprising a substantially planar mounting surface;
• an electronic device that comprises an upper main surface with a conductive pad and a rear surface opposite the upper main surface;
• a connection body that comprises a glass base structure and an electrically conductive wiring structure,
• wherein the connection body is mounted on the chip carrier with the glass base structure facing and adhered to the mounting surface,
• wherein an enclosed cavity is disposed between the connection body and the chip carrier,
• wherein the electronic chip is disposed within the enclosed cavity,
• wherein the electrically conductive wiring structure is connected to the conductive pad of the electronic chip,
• wherein the electronic chip is mounted on the chip carrier such that the rear surface is flush against the mounting surface.

A semiconductor device, comprising

• a chip carrier comprising a substantially planar mounting surface;
• an electronic device that comprises an upper main surface with a conductive pad;
• a connection body that comprises a glass base structure and an electrically conductive wiring structure,
• wherein the connection body is mounted on the chip carrier with the glass base structure facing and adhered to the mounting surface,
• wherein an enclosed cavity is disposed between the connection body and the chip carrier,
• wherein the electronic chip is disposed within the enclosed cavity,
• wherein a conductive track of the electrically conductive wiring structure is disposed directly over the upper main surface and electrically contacts the conductive pad.