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US 2020/0091057 A1Published application
Mounting structure and module
AssigneeFujikura Ltd.
InventorKohei Matsumaru
Life of this patent
Estimating the term…
Abstract
A mounting structure includes a semiconductor device including a first terminal, a wiring substrate including a second terminal having a first end, a wiring extracted from an end face of the first end, and a photosensitive insulating film that covers the wiring and the first end, the second terminal being disposed facing the first terminal, and a bump that electrically connects the first terminal and the second terminal.
Claims6
A mounting structure comprising:
- a semiconductor device including a first terminal;
- a wiring substrate including a second terminal having a first end a wiring extracted from an end face of the first end, and a photosensitive insulating film that covers the wiring and the first end, the second terminal being disposed facing the first terminal;
- and
- a bump that electrically connects the first terminal and the second terminal.
1 more element
Dependencies are inferred from the claim text.