Fan-out semiconductor package

A semiconductor package comprising:

• a connection member including a redistribution layer;
• a semiconductor chip disposed above the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, the active surface facing the connection member;
• an interconnection member disposed above the connection member, disposed adjacent to the semiconductor chip and including a conductive portion;
• an encapsulant disposed above the connection member and encapsulating at least portions of the inactive surface of the semiconductor chip and the interconnection member;
• a conductive layer embedded in the encapsulant such that one surface of the conductive layer is exposed;
• and
• a resin layer disposed on the encapsulant and covering at least portions of the one surface of the conductive layer,
• wherein a first opening penetrating the resin layer and the encapsulant exposes a portion of the conductive portion of the interconnection member, and
• a second opening penetrating the resin layer exposes a portion of the conductive layer.