Integrated circuit package supports having inductors with magnetic material
AssigneeIntel Corporation
InventorsSameer Paital, Srinivas V. Pietambaram, Yonggang Li, Kristof Kuwawi Darmawikarta, Gang Duan, Krishna Bharath, Michael James Hill
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Abstract
Disclosed herein are integrated circuit (IC) package supports having inductors with magnetic material therein. For example, in some embodiments, an IC package support may include an inductor including a solenoid, a first portion of a magnetic material in an interior of the solenoid, and a second portion of magnetic material outside the interior of the solenoid.
Claims25
An integrated circuit (IC) package support, comprising:
- an inductor, including:
- a solenoid,
- a first portion of a magnetic material in an interior of the solenoid, and
- a second portion of magnetic material outside the interior of the solenoid.
An integrated circuit (IC) package, comprising:
- an IC package support having an inductor embedded therein, wherein the inductor includes a solenoid and a magnetic structure around the solenoid, and the magnetic structure includes multiple portions of magnetic material oriented perpendicular to a longitudinal axis of the solenoid;
- and
- a die coupled to the IC package support.
A coreless integrated circuit (IC) package support, comprising:
- an inductor, including:
- a solenoid, and
- a magnetic material in an interior of the solenoid.
A computing device, comprising:
- a circuit board;
- and
- an integrated circuit (IC) package coupled to the circuit board, wherein the IC package includes an IC package support and a computing component coupled to the IC package support, the IC package support includes an inductor, and the inductor includes a solenoid having magnetic material interior to the solenoid or exterior to the solenoid.
Dependencies are inferred from the claim text.