Integrated Circuit Package and a method for Forming a Wafer Level Chip Scale Package (WLCSP) with Through Mold Via (TMV)

A method for forming a wafer level chip scale package comprising the steps of:

• providing an integrated circuit wafer having been patterned with functional electronic circuitry and covered with a passivation insulation layer with openings to allow access to input/output contacts of the integrated circuit;
• applying a coating of a dielectric material to the integrated circuit wafer;
• forming opening locations for a redistribution layer in the dielectric material;
• forming the redistribution conductive layer upon the dielectric polymer layer to make contact through the openings in the dielectric layer and the passivation layer with the input/output contacts of the integrated circuit formed on the surface of the integrated circuit wafer;
• forming alignment marks are placed on the edge of the integrated circuit wafer;
• applying a polymer-based film to the surface of the integrated circuit wafer;
• performing compression molding on the polymer-based film;
• exposing the alignment marks after the molding process;
• forming a through mold via (TMV) in the polymer-based film in the location of an input/output connector for connection to the second level package;
• and
• placing the input/output connector in the through mold via (TMV);
• and
• attaching the input/output connector to the redistribution level.