Package Substrate and Method for Manufacturing Package Substrate

Abstract

The present invention provides a package substrate in which metal pins capable of providing an electrical connection are disposed without tilting, and a method of producing the package substrate. The present invention provides a package substrate including: a substrate; and an electrode disposed on a surface of the substrate, wherein a metal pin is disposed on the electrode via a cured product of a conductive paste containing a metal powder and a thermosetting resin, and the metal powder contains a low-melting point metal and a high-melting point metal having a melting point higher than that of the low-melting point metal.

Dependencies are inferred from the claim text.