Package structure of a folding magnetic coupling isolator, leadframe component, and leadframe structure

A package structure of a folding magnetic coupling isolator, comprising:

• a first leadframe including a first chip-mounting portion, a first coil portion, a plurality of first pin portions and a plurality of first floated pins;
• a second leadframe including a second chip-mounting portion, a second coil portion, a plurality of second pins and a plurality of second floated pins;
• a first chip disposed on the first chip-mounting portion;
• a second chip disposed on the second chip-mounting portion;
• and
• an insulating package enclosing the first chip and the second chip, and connecting the first leadframe to the second leadframe, wherein a portion of each of the first pins is exposed from the insulating package and a portion of each of the second pin is exposed from the insulating package;
• wherein the first leadframe is disposed above or under the second leadframe for aligning the first coil with the second coil and enabling the first coil and the second coil to magnetically couple to each other;
• wherein the first leadframe and the second leadframe are electrically isolated from each other.

A leadframe structure of a folding magnetic coupling isolator, comprising:

• a frame body;
• a first leadframe including a first chip-mounting portion for carrying a first chip, a first coil portion, a plurality of first pins and a plurality of first floated pins;
• a second leadframe including a second chip-mounting portion for carrying a second chip, a second coil portion, a plurality of second pins and a plurality of second floated pins;
• wherein the first leadframe and the second leadframe are both connected to the frame body;
• and wherein the first coil portion and the second coil portion are respectively connected to the plurality of the first floated pins and the plurality of the second floated pins.