Heat dissipation module

A heat dissipation module, configured to dissipate heat from a heat source of an electronic device, the electronic device having a housing with a plurality of opening holes, the heat source disposed in the housing, and the heat dissipation module comprising:

• a heat pipe, one end of the heat pipe being in thermal contact with the heat source;
• a plurality of fins, stacked up to be combined with one another and structurally propped against another end of the heat pipe, the fins forming a plurality of flow inlets and a plurality of flow outlets;
• and
• a fan, disposed at the flow inlets, air flow generated by the fan flowing in the fins via the flow inlets and flowing out of the fins via the flow outlets, wherein portions of the fins at the flow outlets form a plurality of bendings adjacent to and facing toward the opening holes, the air flow from the flow outlets flows out of the housing via the opening holes, and a pitch between any adjacent fins at the bendings is less than 1 mm to form a barrier preventing a foreign object entering the housing via the flow outlets of the fins.