Semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHsin-En CHEN, Ian HU, Jin-Feng YANG
Life of this patent
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Abstract
A semiconductor package structure includes a package substrate, a semiconductor die, a vapor chamber and a heat dissipating device. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is electrically connected to the first surface of the package substrate. The vapor chamber is thermally connected to a first surface of the semiconductor die. The vapor chamber defines an enclosed chamber for accommodating a first working liquid. The heat dissipating device is thermally connected to the vapor chamber. The heat dissipating device defines a substantially enclosed space for accommodating a second working liquid.
Claims20
A semiconductor package structure, comprising:
- a package substrate having a first surface and a second surface opposite to the first surface;
- a semiconductor die electrically connected to the first surface of the package substrate;
- a vapor chamber thermally connected to a first surface of the semiconductor die, wherein the vapor chamber defines an enclosed chamber for accommodating a first working liquid;
- and
- a heat dissipating device thermally connected to the vapor chamber, wherein the heat dissipating device defines a substantially enclosed space for accommodating a second working liquid.
A semiconductor package structure, comprising:
- a package substrate;
- a semiconductor die electrically connected to the package substrate;
- a vapor chamber thermally connected to the semiconductor die;
- and
- a heat dissipating device thermally connected to the vapor chamber, wherein the vapor chamber forms a heat transfer path from the semiconductor die to the heat dissipating device.
Dependencies are inferred from the claim text.