Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices

A system comprising:

• one or more devices to be cooled;
• and
• a module base carrying the one or more devices, the module base comprising a cover and a heat sink connected to the cover;
• the cover comprising first and second encapsulation layers and a thermal spreader between the first and second encapsulation layers, the first encapsulation layer configured to receive thermal energy from the one or more devices, the thermal spreader configured to spread out at least some of the thermal energy received through the first encapsulation layer and to provide the spread-out thermal energy to the second encapsulation layer;
• the heat sink configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base;
• the first encapsulation layer comprising multiple openings, the module base further comprising multiple tabs inserted through the openings, each tab configured to provide a thermal interface between at least one of the one or more devices to be cooled and the thermal spreader through the first encapsulation layer.

A method comprising:

• placing a thermal spreader between first and second encapsulation layers, the first encapsulation layer configured to receive thermal energy from one or more devices to be cooled, the thermal spreader configured to spread out at least some of the thermal energy received through the first encapsulation layer and to provide the spread-out thermal energy to the second encapsulation layer;
• connecting the first and second encapsulation layers together to secure the thermal spreader between the first and second encapsulation layers;
• inserting multiple tabs through openings in the first encapsulation layer, each tab configured to provide a thermal interface between at least one of the one or more devices to be cooled and the thermal spreader through the first encapsulation layer;
• and
• connecting a heat sink to the second encapsulation layer, the heat sink configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy.