Semiconductor package, semiconductor device and method for packaging semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsAlbert Wan, Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu
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Abstract
A semiconductor package, a semiconductor device and a method for packaging the semiconductor device are provided. A semiconductor package includes a first conductive wire layer with a first mounting area and a second mounting area, an integrated circuit (IC), a radiation fin structure and an antenna. The first mounting area and the second mounting area do not overlap. The IC is disposed on a first surface of the first mounting area. The radiation fin structure is disposed on a second surface of the first mounting area. The antenna is disposed on the second mounting area.
Claims20
A semiconductor package, comprising:
- a first conductive wire layer with a first mounting area and a second mounting area, wherein the first mounting area and the second mounting area do not overlap;
- an integrated circuit (IC) disposed on a first surface of the first mounting area, wherein the IC is electrically insulated from the first conductive wire layer;
- a radiation fin structure, disposed on a second surface of the first mounting area;
- and
- an antenna, disposed on the second mounting area.
A semiconductor device, comprising:
- a semiconductor package, comprising:
- a first conductive wire layer with a first mounting area and a second mounting area, wherein the first mounting area and the second mounting area do not overlapped;
- an integrated circuit (IC) disposed on a first surface of the first mounting area, wherein the IC is electrically insulated from the first conductive wire layer;
- a radiation fin structure, disposed on a second surface of the first mounting area;
- and
- an antenna, disposed on the second mounting area;
- and
- a printed circuit board, connected to the semiconductor package by at least one solder ball.
A method for packaging a semiconductor device, comprising:
- providing a first conductive wire layer with a first mounting area and a second mounting area, wherein the first mounting area and the second mounting area do not overlapped;
- disposing an integrated circuit (IC) on a first surface of the first mounting area, wherein the IC is electrically insulated from the first conductive wire layer;
- disposing a radiation fin structure on a second surface of the first mounting area;
- and
- providing an antenna on the second mounting area.
Dependencies are inferred from the claim text.