Semiconductor package system
AssigneeSamsung Electronics Co., Ltd.
InventorHeungkyu KWON
Life of this patent
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Abstract
Disclosed is a semiconductor package system comprising a substrate, a first semiconductor package on the substrate, and a heat radiation structure on the first semiconductor package. The heat radiation structure includes a first part on a top surface of the first semiconductor package and a second part connected to the first part. The second part has a bottom surface at a level lower than a level of the top surface of the first semiconductor package. A vent hole is provided between an edge region of the substrate and the first part of the heat radiation structure.
Claims20
A semiconductor package system, comprising:
- a substrate;
- a first semiconductor package on the substrate;
- and
- a heat radiation structure on the first semiconductor package,
- wherein the heat radiation structure includes:
- a first part on a top surface of the first semiconductor package;
- and
- a second part connected to the first part, the second part having a bottom surface at a level lower than a level of the top surface of the first semiconductor package, the heat radiation structure having a vent hole between an edge region of the substrate and the first part of the heat radiation structure.
A semiconductor package system, comprising:
- a substrate;
- a heat radiation structure on the substrate, the heat radiation structure including a first part and a second part;
- a plurality of semiconductor packages between the substrate and the first part of the heat radiation structure, the semiconductor packages being coupled to the substrate;
- and
- an adhesive layer between the substrate and the second part of the heat radiation structure, the heat radiation structure having a vent hole between an edge region of the substrate and the first part of the heat radiation structure.
A semiconductor package system, comprising:
- a substrate having a central region, a first edge region, and a second edge region;
- a semiconductor package on the central region of the substrate;
- and
- a heat radiation structure on the semiconductor package,
- wherein the heat radiation structure includes:
- a first bottom surface in the first edge region of the substrate and the semiconductor package, the first bottom surface being at a level higher than a level of a top surface of the semiconductor package;
- and
- a second bottom surface overlapping the second edge region of the substrate, the second bottom surface being at a level lower than a level of the top surface of the semiconductor package, and
- wherein the first and second edge regions of the substrate are adjacent to a side surface of the substrate.
Dependencies are inferred from the claim text.