Package structure with lid and method for forming the same

A package structure, comprising:

• a semiconductor die formed over a first side of an interconnect structure;
• a first stacked die package structure formed over the first side of the interconnect structure, wherein the first stacked die package structure comprises a plurality of memory dies;
• a second stacked die package structure formed over the first side of the interconnect structure, wherein the semiconductor die is between the first stacked die package structure and the second stacked die package structure, and the second stacked die package structure comprises a plurality of memory dies;
• and
• a lid structure formed over the semiconductor die and the first stacked die package structure, wherein the lid structure has a T-shaped structure, and a bottommost surface of the lid structure is lower than a top surface of the first stacked die package structure.

A package structure, comprising:

• a semiconductor die formed over a first side of an interconnect structure;
• a first stacked die package structure formed over the first side of the interconnect structure, wherein the first stacked die package structure comprises a plurality of memory dies;
• and
• a lid structure formed over the semiconductor die and the first stacked die package structure, wherein a bottommost surface of the lid structure is higher than a top surface of the semiconductor die and lower than a top surface of the first stacked die package structure.