US 2020/0091025 A1 · SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Abstract

The semiconductor device includes an insulating circuit substrate mounted with a semiconductor element; an external terminal; a base including a support portion; an adhesive sheet; and a sealing portion covering the semiconductor element. The support portion has a first surface, a second surface on the side opposite to the first surface, and a first opening opened at the first surface and the second surface. The insulating circuit substrate is disposed in the first opening. The adhesive sheet is disposed on the second surface of the support portion and has a second opening in which the semiconductor element is disposed in plan view. The adhesive sheet is projected into the first opening in plan view and adhered to a circuit block. The external terminal is adhered on the adhesive sheet and has a connecting surface to which a bonding wire is connected.

Claims17

Dependent claims

A semiconductor device comprising:

an insulating circuit substrate mounted with a semiconductor element;
an external terminal;
a base including a support portion;
an adhesive sheet;
and
a sealing portion covering the semiconductor element,
wherein:
the support portion has a first surface, a second surface on a side opposite to the first surface, and a first opening opened at the first surface and the second surface, the insulating circuit substrate disposed in the first opening;
the adhesive sheet is disposed on the second surface of the support portion and has a second opening in which the semiconductor element is disposed in plan view, the adhesive sheet projected into the first opening in plan view and adhered to the insulating circuit substrate;
and
the external terminal is adhered on the adhesive sheet and has a connecting surface to which a bonding wire is connected.

8 more elements

A semiconductor device manufacturing method comprising:

preparing an insulating circuit substrate mounted with a semiconductor element, a base including a support portion having a first opening in which the insulating circuit substrate is allowed to be disposed, an adhesive sheet having a second opening, and an external terminal having a connecting surface to which a bonding wire is to be connected;
disposing the support portion and the adhesive sheet so that the second opening is superimposed on the first opening and that part of the adhesive sheet is located on an inner side of the first opening in plan view;
disposing the external terminal on the adhesive sheet to form a laminate;
turning the laminate upside down so that a surface of the adhesive sheet faces downward, and disposing the upside-down laminate on a first metal block to bring the surface of the adhesive sheet into contact with the first metal block;
inserting the insulating circuit substrate into the first opening by keeping a surface, mounted with the semiconductor element, of the insulating circuit substrate to face downward;
disposing a second metal block on upper surfaces of the insulating circuit substrate and the support portion to bring the second metal block into contact with the insulating circuit substrate;
applying heat pressing to the laminate and the insulating circuit substrate by the first metal block and the second metal block to cure the adhesive sheet;
and
sealing the semiconductor element with a resin material to form a sealing portion.

6 more elements

Dependencies are inferred from the claim text.

Semiconductor device and method of manufacturing semiconductor device

Life of this patent

Semiconductor device and method of manufacturing semiconductor device

Life of this patent

Abstract

Claims17