Substrate bonding method, multilayer substrate manufacturing method, multilayer substrate manufacturing apparatus, and multilayer substrate manufacturing system

A substrate bonding method comprising:

• holding a first substrate with a first holding section;
• holding a second substrate with a second holding section in a manner to face the first substrate;
• and
• bonding the first substrate and the second substrate by releasing the hold on one of the first substrate and the second substrate, wherein
• the bonding includes releasing the hold on a substrate, among the first substrate and the second substrate, in which distortion occurring in a bonding process satisfies a prescribed condition.

A substrate bonding method comprising:

• holding a first substrate with a first holding section;
• holding a second substrate with a second holding section;
• correcting positional misalignment between the first substrate and the second substrate;
• and
• bonding the first substrate and the second substrate by releasing the hold on one of the first substrate and the second substrate, wherein
• a substrate, among the first substrate and the second substrate, causing a correction amount for positional misalignment predicted for after the bonding with a magnitude capable of being corrected by the correcting is released from the hold.

A multilayer substrate manufacturing method comprising:

• bonding a first substrate held by a first holding section and a second substrate held by a second holding section, by releasing the hold on at least one of the first substrate and the second substrate;
• and
• determining which of the first substrate and the second substrate is to be released from the hold or continued to be held, based on information concerning distortion occurring in the bonding of the first substrate and the second substrate, wherein
• the bonding includes releasing the hold on the substrate that was determined to be released in the determining.

A multilayer substrate manufacturing apparatus comprising:

• a first holding section holding a first substrate;
• and
• a second holding section holding a second substrate, wherein
• the multilayer substrate manufacturing apparatus manufactures a multilayer substrate by bonding the first substrate and the second substrate, by releasing the hold on one of the first substrate and the second substrate, and
• a substrate, among the first substrate and the second substrate, causing positional misalignment after bonding that is less than or equal to a threshold value is released from the hold.

A multilayer substrate manufacturing apparatus, comprising:

• a first holding section that holds a first substrate;
• and
• a second holding section that holds a second substrate in a manner to face the first substrate, wherein
• the multilayer substrate manufacturing apparatus manufactures a multilayer substrate by bonding the first substrate and the second substrate, by releasing the hold on one of the first substrate and the second substrate, and
• a substrate, among the first substrate and the second substrate, in which distortion occurring in a bonding process satisfies a prescribed condition is released from the hold.

A multilayer substrate manufacturing apparatus, comprising:

• a first holding section that holds a first substrate;
• a second holding section that holds a second substrate in a manner to face the first substrate;
• and
• a correcting section that corrects positional misalignment between the first substrate and the second substrate, wherein
• the multilayer substrate manufacturing apparatus manufactures a multilayer substrate by bonding the first substrate and the second substrate, by releasing the hold on one of the first substrate and the second substrate, and
• a substrate, among the first substrate and the second substrate, causing a correction amount for positional misalignment predicted for after the bonding with a magnitude capable of being corrected by the correcting section is released from the hold.

A multilayer substrate manufacturing system comprising:

• a bonding section that includes a first holding section holding a first substrate and a second holding section holding a second substrate, and bonds the first substrate and the second substrate by releasing the hold on one of the first substrate and the second substrate;
• and
• a determining section that determines which of the first substrate and the second substrate is to be released from the hold or continued to be held, based on information concerning distortion occurring during a bonding process of the first substrate and the second substrate, wherein
• the bonding section releases the hold on the substrate determined to be released by the determining section.