Method for Reducing Metal Plug Corrosion and Device

A method comprising:

• forming a dielectric layer, the dielectric layer having a recess;
• forming a conductive layer in the recess;
• performing a CMP operation on the conductive layer to form a conductive feature;
• and
• exposing the conductive layer to a metal ion source solution during the CMP operation, wherein a constituent metal of a metal ion in the metal ion source solution and a constituent metal of the conductive layer are the same, and wherein the metal ion in the metal ion source solution reduces an anodic oxidation reaction rate of the conductive feature.

A method of manufacturing a device comprising:

• depositing a conductive layer;
• performing a planarization process on the conductive layer;
• and
• exposing the conductive layer to a metal ion source solution during the planarization process, wherein a constituent metal of a metal ion in the metal ion source solution and the conductive layer is the same, the constituent metal in the conductive layer being a reactant of a reaction with the metal ion source solution, and the metal ion in the metal ion source solution shifting an equilibrium of the reaction towards the reactants.