Back to results
US 2020/0090974 A1Published application
Tape heating methods
AssigneeSemiconductor Components Industries, LLC
InventorMichael J. SEDDON
Life of this patent
Estimating the term…
Abstract
Implementations of a method of increasing the adhesion of a tape. Implementations may include: mounting a tape to a frame, mounting a substrate to the tape, heating the tape after mounting the substrate at one or more temperatures for a predetermined period of time, and increasing an adhesion of the tape to the substrate through heating the tape.
Claims20
A method of increasing an adhesion of a dicing tape, the method comprising:
- mounting the dicing tape to a frame;
- mounting a substrate to the dicing tape after the dicing tape is mounted to the frame;
- heating the dicing tape after mounting the substrate at one or more temperatures for a predetermined period of time;
- increasing an adhesion of the dicing tape to the substrate through heating the dicing tape;
- and
- removing one or more portions of the substrate through releasing the dicing tape from the one or more portions.
3 more elements
A method of increasing an adhesion of a dicing tape, the method comprising:
- mounting a semiconductor substrate to the dicing tape after mounting the dicing tape to a frame;
- heating the dicing tape after mounting the semiconductor substrate at one or more temperatures less than 100 C for a predetermined period of time;
- and
- increasing an adhesion of the dicing tape to the semiconductor substrate through heating the dicing tape;
- removing one or more portions of the substrate through releasing the dicing tape from the one or more portions.
2 more elements
A method of preventing die loss from a dicing tape, the method comprising:
- mounting a semiconductor substrate to the dicing tape;
- heating the tape after mounting the semiconductor substrate at one or more temperatures for a predetermined period of time;
- at least partially singulating a plurality of die from the semiconductor substrate before heating the tape;
- and
- preventing die from prematurely decoupling from the dicing tape during subsequent processing operations by increasing an adhesion of the plurality of die to the dicing tape through heating the dicing tape;
- removing one or more portions of the substrate through releasing the dicing tape from the one or more portions.
3 more elements
Dependencies are inferred from the claim text.