Wafer surface beveling method, method of manufacturing wafer, and wafer

A system for polishing a chamfered surface of a wafer including a main surface and a chamfered surface, the system comprising:

• a polishing pad mounting jig configured to polish the chamfered surface of the wafer, an angle θ being defined between the chamfered surface and the main surface;
• and
• a polishing pad mounted on the polishing pad mounting jig, the polishing pad being in contact with the chamfered surface and at an angle α with respect to the chamfered surface during polishing;
• wherein the angle α is smaller than the angle θ.

A wafer, comprising:

• a front main wafer surface and a rear main wafer surface;
• and
• a front chamfered surface and a rear chamfered surface, the front chamfered surface being inclined with respect to the front main surface by an angle θ1, and the rear chamfered surface being inclined with respect to the rear main surface by an angle θ2;
• wherein a degree of corner burring inhibition at least at one of a boundary between the front main wafer surface and the front chamfered surface and a boundary between the rear main wafer surface and the rear chamfer surface is 180 μm or more.