Detecting defects in a logic region on a wafer
AssigneeKLA Corporation
InventorsJunqing Huang, Paul Russell, Hucheng Lee, Kenong Wu
Life of this patent
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AssigneeKLA Corporation
InventorsJunqing Huang, Paul Russell, Hucheng Lee, Kenong Wu
Estimating the term…
Methods and systems for detecting defects in a logic region on a wafer are provided. One method includes acquiring information for different types of design-based care areas in a logic region of a wafer. The method also includes designating the different types of the design-based care areas as different types of sub-regions and, for a localized area within the logic region, assigning two or more instances of the sub-regions located in the localized area to a super-region. In addition, the method includes generating one scatter plot for all of the two or more instances of the sub-regions assigned to the super-region. The one scatter plot is generated with different segmentation values for the output corresponding to the different types of the sub-regions. The method further includes detecting defects in the sub-regions based on the one scatter plot.
A system configured to detect defects in a logic region on a wafer, comprising:
A non-transitory computer-readable medium, storing program instructions executable on a computer system for performing a computer-implemented method for detecting defects in a logic region on a wafer, wherein the computer-implemented method comprises:
A computer-implemented method for detecting defects in a logic region on a wafer, comprising:
Dependencies are inferred from the claim text.