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US 2020/0090895 A1Published application
Metal encapsulated photocathode electron emitter
AssigneeKLA-Tencor Corporation
InventorsGildardo R. Delgado, Katerina Ioakeimidi, Frances Hill, Gary V. Lopez Lopez, Rudy F. Garcia
Life of this patent
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Abstract
A photocathode structure, which can include one or more of Cs2Te, CsKTe, CsI, CsBr, GaAs, GaN, InSb, CsKSb, or a metal, has a protective film on an exterior surface. The protective film includes one or more of ruthenium, nickel, platinum, chromium, copper, gold, silver, aluminum, or an alloy thereof. The protective film can have a thickness from 1 nm to 10 nm. The photocathode structure can be used in an electron beam tool like a scanning electron microscope.
Claims20
An electron emitter comprising:
- a photocathode structure that includes one or more of Cs2Te, CsKTe, CsI, CsBr, GaAs, GaN, InSb, CsKSb, or a metal;
- and
- a protective film disposed on an exterior surface of the photocathode structure, wherein the protective film includes one or more of ruthenium, nickel, platinum, chromium, copper, gold, silver, aluminum, or an alloy thereof.
A method comprising:
- providing a photocathode structure that includes one or more of Cs2Te, CsKTe, CsI, CsBr, GaAs, GaN, InSb, CsKSb, or a metal;
- depositing a protective film on an exterior surface of the photocathode structure, wherein the protective film includes one or more of ruthenium, nickel, platinum, chromium, copper, gold, silver, aluminum, or an alloy thereof.
A method comprising:
- providing a photocathode structure, wherein the photocathode includes one or more of Cs2Te, CsKTe, CsI, CsBr, GaAs, GaN, InSb, CsKSb, or a metal and a protective film disposed on an exterior surface of the photocathode structure, wherein the protective film includes one or more of ruthenium, nickel, platinum, chromium, copper, gold, silver, aluminum, or an alloy thereof;
- and
- generating an electron beam from the photocathode structure when photons are directed at the photocathode structure.
Dependencies are inferred from the claim text.