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US 2020/0090854 A1Published application
High density coil design and process
AssigneeHutchinson Technology Incorporated
InventorsJohn L. Schumann, Nole D. German, Trent A. Johnson, Duane M. Jelkin, Matthew S. Lang, Ryan N. Ruzicka, Forrest A. Cravens, Todd A. Peter, Zachary A. Pokomowski
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Abstract
Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.
Claims20
A device comprising:
- a substrate;
- and
- a plurality of coil portions disposed on the substrate, the plurality of coil portions electrically coupled to form a coil structure.
A structure comprising:
- a substrate;
- and
- a plurality of surface mount circuits, the plurality of surface mount circuits disposed on the substrate and electrically coupled to each other.
Dependencies are inferred from the claim text.