High-aspect ratio electroplated structures and anisotropic electroplating processes
AssigneeHutchinson Technology Incorporated
InventorsDouglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig, Matthew S. Lang, Paul V. Pesavento, Joseph D. Starkey
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Abstract
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
Claims20
A device comprising:
- a dielectric layer having a first surface and a second surface;
- and
- a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer;
- a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
The device of claim 11, wherein at least a portion of the second set of high-aspect ratio electroplated structures are formed using a crown plating process.
A coil comprising:
- a dielectric layer having a first surface and a second surface;
- and
- a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer;
- a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
Dependencies are inferred from the claim text.