Magnetic substrate and method of manufacturing the same, bonding structure between magnetic substrate and insulating material, and chip component having the bonding structure
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSa Yong LEE, Yong Il KWON, Jin Ho HONG, Sung Han KIM, Keun Yong LEE
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Abstract
A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.
Claims18
A chip component, comprising:
- a magnetic substrate comprising ferrite layers;
- an insulating layer, disposed on the magnetic substrate, having an electrode disposed therein, wherein the magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween, the chemical coupling structure comprising Si—O—C or Si—O—N;
- and
- an external electrode connected to the electrode on the insulating layer,
- wherein one ferrite layer of the ferrite layers in contact with another ferrite layer of the ferrite layers each comprises a glass component, glass component concentrations of the one ferrite layer in contact with the another ferrite layer are different from each other, and the one ferrite layer or the another ferrite layer with a higher glass component concentration is in contact with the insulating layer.
A chip component, comprising:
- a magnetic substrate comprising ferrite layers;
- an electrode layer having an insulating layer covering the magnetic substrate and a coil electrode formed in the insulating layer, wherein the magnetic substrate is adhered to the insulating layer by chemical coupling having a chemical structure of Si—O—C or Si—O—N;
- a magnetic composite material, covering the electrode layer, comprising a hole exposing a portion of the coil electrode;
- and
- an external electrode, enclosed by the magnetic composite material, connected to the coil electrode through the hole,
- wherein one ferrite layer of the ferrite layers in contact with another ferrite layer of the ferrite layers each comprises a glass component, the glass component concentrations of the one ferrite layer in contact with the another ferrite layer are different from each other, and the one ferrite layer or the another ferrite layer with a higher glass component concentration is in contact with the insulating layer.
A magnetic substrate manufactured by firing or sintering a multilayer structure in which ferrite sheets are stacked,
- wherein the multilayer structure comprises a core layer disposed at a central portion thereof and an outer layer stacked on the core layer and disposed at an outermost portion thereof, and the outer layer has silanol groups formed on a surface thereof, and
- wherein the outer layer in contact with the core layer each comprises a glass component, glass component concentrations of the outer layer in contact with the core layer are different from each other, and the outer layer has a higher glass component concentration and is in contact with an insulating layer.
A bonding structure between a magnetic substrate and an insulating material,
- wherein the magnetic substrate comprises ferrite layers, and the insulating material adheres to the magnetic substrate by a chemical coupling structure comprising Si—O—C or Si—O—N, and
- wherein one ferrite layer of the ferrite layers in contact with another ferrite layer of the ferrite layers each comprises a glass component, glass component concentrations of the one ferrite layer in contact with the another ferrite layer are different from each other, and the one ferrite layer or the another ferrite layer with a higher glass component concentration is in contact with the insulating material.
Dependencies are inferred from the claim text.