Electronic component and manufacturing method thereof

A manufacturing method of an electronic component, the manufacturing method comprising:

• forming at least one first paste portion extending in a first direction on a substrate;
• forming a conductor film on the substrate on which the at least one first paste portion is formed;
• converting the conductor film to at least one primary conductor pattern extending in the first direction on the substrate, by removing the at least one first paste portion and portions of the conductor film disposed on the at least one first paste portion;
• and
• forming a plurality of primary electrode patterns having at least a portion overlapping the at least one primary conductor pattern.

An electronic component comprising:

• a substrate;
• a conductor pattern portion disposed on the substrate and extending in a first direction;
• a first electrode pattern and a second electrode pattern disposed at opposite ends of the conductor pattern portion in the first direction, respectively, and disposed on the conductor pattern portion;
• first and second dummy electrode patterns disposed on opposite sides of the first electrode pattern in a second direction different from the first direction;
• and
• third and fourth dummy electrode patterns disposed on opposite sides of the second electrode pattern in the second direction,
• wherein the first to fourth dummy electrode patterns and the first and second electrode patterns are made of a same material, and
• the first to fourth dummy electrode patterns are disposed on a level lower than that of the first and second electrode patterns with respect to a surface of the substrate on which the conductor pattern portion is disposed.