Electronic component and manufacturing method thereof

An electronic component comprising:

• a substrate;
• a conductor pattern portion disposed on the substrate and extending in a first direction;
• a first electrode pattern and a second electrode pattern disposed at opposite ends of the conductor pattern portion in the first direction, respectively, and disposed on the conductor pattern portion;
• at least one dummy conductor pattern spaced apart from the conductor pattern portion and disposed on the substrate;
• and
• at least one dummy electrode pattern spaced apart from the first electrode pattern and the second electrode pattern and disposed on the at least one dummy conductor pattern,
• wherein a width, in a second direction different from the first direction, of the first electrode pattern is substantially the same as a width, in the second direction different from the first direction, of a portion of the conductor pattern portion in contact with the first electrode pattern, and
• a width, in the second direction different from the first direction, of the second electrode pattern is substantially the same as a width, in the second direction different from the first direction, of a portion of the conductor pattern portion in contact with the second electrode pattern.