US 2020/0090839 A1 · CHIP RESISTOR MANUFACTURING METHOD, AND CHIP RESISTOR

Abstract

A chip resistor having a predetermined resistance value is manufactured by the following method. A resistive element is provided on an upper surface of an insulating substrate. The resistive element includes a wide portion, a first narrow portion extending from the wide portion, and a part extending from the wide portion, the first narrow portion has a smaller width than the wide portion. First and second electrodes are provided on the upper surface of the insulating substrate. The first electrode is located away from the wide portion. The first electrode contacts the first narrow portion. The first electrode overlaps the first narrow portion when viewed from above. The second electrode contacts the part of the resistive element. The second electrode overlaps the part of the resistive element when viewed from above. A distance between the narrow portion and the wide portion is determined so as to cause a resistance value between the first and second electrodes to be the predetermined resistance value. This method improves the precision of the resistance value of the chip resistor.

Claims14

Dependent claims

A method of manufacturing a chip resistor having a predetermined resistance value, the method comprising:

providing a resistive element on an upper surface of an insulating substrate, the resistive element including a wide portion, a first narrow portion extending from the wide portion, and a part extending from the wide portion, the first narrow portion having a smaller width than the wide portion;
providing a first electrode on a first end portion of the upper surface of the insulating substrate, the first electrode being located away from the wide portion by a first distance, the first electrode contacting the first narrow portion, the first electrode overlapping the first narrow portion when viewed from above;
providing a second electrode on a second end portion of the upper surface of the insulating substrate, the second electrode contacting the part of the resistive element, the second electrode overlapping the part of the resistive element when viewed from above;
determining the first distance so as to cause a resistance value between the first electrode and the second electrode to be the predetermined resistance value.

1 more element

A chip resistor comprising:

an insulating substrate;
a first electrode provided on a first end portion of an upper surface of the insulating substrate;
a second electrode provided on a second end portion of the upper surface of the insulating substrate;
a resistive element provided on the upper surface of the insulating substrate and connected to the first electrode and the second electrode, the resistive element overlapping the first electrode and the second electrode;
a third electrode covering the first electrode;
and
a fourth electrode covering the second electrode,
wherein the resistive element includes a wide portion, a first narrow portion extending from the wide portion, and a part extending from the wide portion, the wide portion having a trimming groove provided therein, a width of a first narrow portion being smaller than a width of the wide portion,
wherein the first electrode is connected to the first narrow portion of the resistive element, is located away from the wide portion by a first distance, and overlaps the first narrow portion of the resistive element,
wherein the second electrode is connected to the part of the resistive element and overlaps the part of the resistive element, and
wherein the width of the first narrow portion ranges from 60% to 80% of the width of the wide portion.

8 more elements

Dependencies are inferred from the claim text.

Chip resistor manufacturing method, and chip resistor

Life of this patent

Chip resistor manufacturing method, and chip resistor

Life of this patent

Abstract

Claims14