Chip resistor
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorMITSUAKI NAKAO
Life of this patent
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Abstract
An object of the present disclosure is to provide a chip resistor that reduces a possibility of occurrence of a mounting failure. The chip resistor of the present disclosure includes: insulating substrate; a pair of first upper-face electrodes that is provided at both end portions of an upper face of insulating substrate; and resistor that is provided on the upper face of insulating substrate and is formed between the pair of first upper-face electrodes. The chip resistor also includes: a pair of second upper-face electrodes that is formed on upper faces of the pair of first upper-face electrodes and is connected to resistor; and protective film that is provided to cover exposed resistor and part of the pair of second upper-face electrodes.
Claims2
A chip resistor comprising:
- an insulating substrate;
- a pair of first upper-face electrodes that is provided at both end portions of an upper face of the insulating substrate;
- a resistor that is provided on the upper face of the insulating substrate and is formed between the pair of first upper-face electrodes;
- a pair of second upper-face electrodes that is provided on upper faces of the pair of first upper-face electrodes and is provided at both end portions of the resistor;
- and
- a protective film that is provided to cover a portion of the resistor existing between the pair of second upper-face electrodes and part of the pair of second upper-face electrodes,
- wherein a length of a portion of the resistor existing on the pair of first upper-face electrodes is made longer than a length of a portion of the resistor existing between the pair of first upper-face electrodes.
Dependencies are inferred from the claim text.