Layered semiconductor device, and production method therefor

A layered semiconductor wafer including, comprising, layered therein:

• a plurality of semiconductor wafers including a semiconductor chip,
• a reserve semiconductor wafer including a reserve semiconductor chip which is used as a reserve for the semiconductor chip, and
• a control wafer including a control chip which includes a storage unit and controls operating states of a circuit block of the plurality of semiconductor chips and an operating state of a circuit block of the reserve semiconductor chip on the basis of information stored in the storage unit,
• wherein information, which is rerated to a defective circuit block among the plurality of the semiconductor wafers which includes the semiconductor chip and the reserved semiconductor wafer which includes the reserved semiconductor chip, is stored in the storage unit of the control chip overlapped to the semiconductor chip including the defective circuit block among the control wafer.

A layered semiconductor wafer including, comprising, layered therein:

• a plurality of semiconductor wafers including a semiconductor chip,
• a reserve semiconductor wafer including a reserve semiconductor chip which is used as a reserve for the semiconductor chip, and
• a control wafer including a control chip which includes a storage unit and controls states of access to control lines of the plurality of semiconductor chips and a state of access to a control line of the reserve semiconductor chip on the basis of information stored in the storage unit,
• wherein information, which is related to a defected control line among the plurality of semiconductor wafer including the semiconductor chip and the reserved semiconductor wafer including the reserved semiconductor chip, is stored in the storage unit of the control chip overlapped to the semiconductor chip including the defective control line among the control wafer.