Electronic device

An electronic device, comprising:

• a base substrate that includes a bendable region capable of being bent about a bending axis that extends along one direction and a non-bendable region adjacent to the bendable region;
• a display unit that includes a pixel disposed on the base substrate and that includes a thin film transistor, an organic light emitting element connected to the thin film transistor, and a plurality of insulating layers;
• an input sensing unit disposed on the pixel, and that includes a first detection insulating layer, a first detection electrode and a second detection electrode spaced apart from each other with the first detection insulating layer therebetween, and a second detection insulating layer that covers the first detection insulating layer;
• a groove formed through the insulating layers in the bendable region that exposes a part of the base substrate in the bendable region and that extends along the bending axis;
• a first organic layer that covers a part of the exposed base substrate and the groove;
• a connection wiring connected to the pixel through the bendable region;
• and
• a second organic layer that covers the connection wiring,
• wherein the second organic layer comprises a same material as the second detection insulating layer.

A method of manufacturing an electronic device, comprising the steps of:

• forming, through a deposition process, a preliminary display unit that includes a base substrate that includes a bendable region capable of being bent about a bending axis that extends along one direction and a non-bendable region adjacent to the bendable region, a thin film transistor on the base substrate, an organic light emitting device connected to the thin film transistor, a sealing layer that covers the organic light emitting device, and a plurality of insulating layers;
• forming a groove by removing a part of each of the insulating layers to expose a part of the base substrate in the bendable region;
• forming a first detection electrode by forming a first conductive layer on the sealing layer and patterning the first conductive layer;
• forming a preliminary organic layer that covers the first detection electrode, a part of the exposed base substrate, and the groove;
• forming a first detection insulating layer that covers the first detection electrode and a first organic layer that covers a part of the exposed portion of the base substrate and the groove by patterning the preliminary organic layer;
• forming a second detection electrode and a connection wiring by forming a second conductive layer on the first detection insulating layer and the bendable region and patterning the second conductive layer;
• and
• forming a second organic layer that covers the second detection electrode and the connection wiring.