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US 2020/0066300 A1Published application
Stress-free tape head module
AssigneeInternational Business Machines Corporation
InventorRobert G. Biskeborn
Life of this patent
Estimating the term…
Abstract
A method according to one embodiment includes attaching a die to a beam, where the die includes an array of transducers in a transducer region of the die, a first region extending from the transducer region to a first end of the die and a second region extending from the transducer region to a second end of the die. The transducer region of the die is attached to the beam, and the first region and the second region are not attached to the beam.
Claims20
A method, comprising:
- attaching a die to a beam, wherein the die comprises an array of transducers in a transducer region of the die, a first region extending from the transducer region to a first end of the die and a second region extending from the transducer region to a second end of the die,
- wherein the transducer region of the die is attached to the beam,
- wherein the first region and the second region are not attached to the beam.
Dependencies are inferred from the claim text.