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US 2020/0056094 A1Published application
Composites with enhanced thermal conductivity and method preparing the same
AssigneeKorea Institute of Science and Technology
InventorsHong Jin LIM, Nam Ho YOU, Seokhoon AHN, Munju GOH, Se Gyu JANG, Myung Jong KIM
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Abstract
The present disclosure relates to a high thermal conductive polymer composite, comprising: a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group, wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.
Claims15
A high thermal conductive polymer composite, comprising:
- a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group,
- wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.
A method of preparing a high thermal conductive polymer composite, comprising:
- mixing a liquid crystalline resin and a linear polymerization initiator to prepare a mixture;
- and
- curing the mixture,
- wherein the liquid crystalline resin comprises a mesogen and at least one linear polymerization reactive group.
1 more element
Dependencies are inferred from the claim text.