Carrier Substrate for Stress Sensitive Device and Method of Manufacture
AssigneeTDK Corporation
InventorWolfgang Pahl
Life of this patent
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Abstract
A carrier substrate and a method for making a carrier substrate are disclosed. In an embodiment a carrier substrate includes a substrate body having a multilayer structure, electrical connection pads on a top surface of the substrate body, an organic cushion layer on the top surface of the substrate body, electrically conductive elongated parts arranged on top of the cushion layer, wherein each conductive elongated part is contacted to a respective electric connection pad and a solder pad located at an end of each elongated part distant from the respective connection pad.
Claims17
1-15. (canceled)
A carrier substrate comprising:
- a substrate body having a multilayer structure;
- electrical connection pads on a top surface of the substrate body;
- an organic cushion layer on the top surface of the substrate body;
- electrically conductive elongated parts arranged on top of the cushion layer, wherein each conductive elongated part is contacted to a respective electric connection pad;
- and
- a solder pad located at an end of each elongated part distant from the respective connection pad.
A method for manufacturing a carrier substrate, the method comprising:
- providing a substrate body having a multilayer structure and an integrated wiring structure connected to electrical connection pads on a top surface of the substrate body;
- applying a structured cushion layer on the top surface of the substrate body or applying a cushion layer to an entire surface and structuring the cushion layer to expose the connection pads on the surface of the substrate body;
- applying a metal layer on top of the cushion layer to completely cover a top surface of the cushion layer and thereby contacting the exposed connection pads on the top surface of the substrate body;
- structuring the metal layer by forming incisions in the metal layer to form electrically conductive elongated parts;
- and
- forming a solder pad at a respective end of an elongated part that is distant from the connection pad so that each elongated part connects a connection pad and a solder pad.
A carrier substrate comprising:
- a substrate body having a multilayer structure;
- electrical connection pads on a top surface of the substrate body;
- a structured organic cushion layer on the top surface of the substrate body;
- electrically conductive elongated parts arranged on top of the cushion layer, wherein each conducive elongated part contacts an electric connection pad;
- and
- solder pads located at ends of the elongated parts distant from the connection pads,
- wherein the elongated parts are defined and structured by incisions cut in a large area metal layer located on top of the structured cushion layer, and
- wherein the incisions are separating and isolating the elongated parts from a remaining metal layer.
Dependencies are inferred from the claim text.