Sensor devices and methods for manufacturing the same
AssigneeInfineon Technologies AG
InventorHorst Theuss
Life of this patent
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Abstract
A sensor device including a leadframe is disclosed. A sensor chip is arranged on the leadframe, an encapsulation material is arranged on a main surface and a side surface of the sensor chip, and a signal port arranged at a side surface of the sensor device. The side surface of the sensor device extends between opposing main surfaces of the sensor device, wherein one of the main surfaces is a mounting surface of the sensor device. A channel extends from the signal port to a sensing structure of the sensor chip.
Claims21
A sensor device, comprising:
- a leadframe;
- a sensor chip arranged on the leadframe;
- an encapsulation material arranged on a main surface and a side surface of the sensor chip;
- a signal port arranged at a side surface of the sensor device, wherein the side surface of the sensor device extends between opposing main surfaces of the sensor device, wherein one of the main surfaces is a mounting surface of the sensor device;
- and
- a channel extending from the signal port through the leadframe to a sensing structure of the sensor chip.
A sensor device, comprising:
- a chip carrier, wherein the chip carrier comprises a multi-layer laminate structure made of a ceramic material, an organic material or a printed circuit board material;
- a sensor chip arranged on the chip carrier;
- an encapsulation structure encapsulating the sensor chip;
- a signal port arranged at a side surface of the sensor device, wherein the side surface of the sensor device extends between opposing main surfaces of the sensor device, one of the main surfaces being a mounting surface of the sensor device, wherein the signal port comprises a hole in the chip carrier;
- and
- a channel extending from the hole in the chip carrier through the chip carrier to a sensing structure of the sensor chip.
A method for manufacturing a sensor device, the method comprising:
- arranging multiple sensor chips on a carrier;
- encapsulating the sensor chips by an encapsulation structure;
- and
- separating the encapsulated sensor chips into multiple sensor devices, wherein a signal port arranged at a side surface of each sensor device is produced by the separation process.
Dependencies are inferred from the claim text.