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AssigneeCanon Kabushiki Kaisha
InventorNorikazu Sugiyama
Estimating the term…
A solder paste is printed on a first surface of a sheet. Connectors are mounted on a first surface of a first board and a second surface of a second board. The sheet is inverted. A solder paste is printed on a second surface of the sheet. Connectors are mounted on a second surface of the first board and a first surface of the second board. The solder paste printed onto the second surface of the sheet is melted. The first board is separated from the second board. The first and second board have the same connector layout. A first connector soldered to the first surface of the first board and a second connector soldered to the second surface of the second board are disposed at a location where the sheet can be bent and broken along the separation line.
A method for manufacturing a plurality of printed circuit boards, each board having the same connector layout, by dividing a single circuit board sheet, the method comprising:
A circuit board sheet including a plurality of printed circuit boards which have the same connector layout, the sheet comprising:
Dependencies are inferred from the claim text.