Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems

A microelectronic device comprising:

• a first substrate having radio frequency (RF) components;
• a second substrate coupled to the first substrate, the second substrate including conductive layers and organic dielectric layers;
• a mold material disposed on the first and second substrates;
• and
• an electromagnetic interference (EMI) shield integrated with the mold material to shield the RF components from EMI.

A computing device comprising:

• at least one processor to process data;
• and
• a communication module or chip coupled to the at least one processor, the communication module or chip comprises,
• a first substrate having radio frequency (RF) components,
• a second substrate coupled to the first substrate, the second substrate including a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 15 GHz or higher;
• and
• a mold material disposed on the first and second substrates, the mold material including a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.