Electronic package
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsBo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai
Life of this patent
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Abstract
An electronic package is provided with a first substrate having a first antenna portion that is stacked on a second substrate having a second antenna portion via an antenna component. During a packaging process, a gap between the first substrate and the second substrate is held constantly by the antenna component. At the same time, the antenna component is regarded as a third antenna portion of the electronic package. The performance of the antennae is not adversely affected by the antenna component despite the fact that the antenna component is in close proximity to the first and second antenna portions.
Claims13
An electronic package, comprising:
- a first substrate including a first wiring layer and a first antenna portion electrically insulated from the first wiring layer;
- a second substrate stacked on the first substrate and including a second wiring layer and a second antenna portion electrically insulated from the second wiring layer, wherein the first antenna portion and the second antenna portion are provided within a projected space of an active zone formed between the first substrate and the second substrate to allow inductive coupling between the first antenna portion and the second antenna portion;
- and
- an antenna component provided between the first substrate and the second substrate and attaching the first substrate to the second substrate, wherein the antenna component is provided within the active zone and is free from being electrically connected to the first wiring layer and the second wiring layer.
Dependencies are inferred from the claim text.