Manufacturing method for oled display panel

A manufacturing method for OLED display panel, which comprises:

• providing an OLED substrate, a cover plate and an encapsulant, wherein the OLED substrate comprising a plurality of OLED substrate units arranged in an array, the encapsulant comprising an encapsulation colloid and two release films adhered respectively to two opposite sides of the encapsulation colloid;
• and
• patterning the encapsulation colloid of the encapsulant, wherein specifically, dividing the encapsulation colloid into a plurality of target encapsulation areas, with each target encapsulation area corresponding to each of the plurality of OLED substrate units, and a gap area outside of the target encapsulation areas, performing disintegration treatment on a portion of the encapsulation colloid belonging to the gap area so that the surface of the portion losing adhesiveness;
• wherein the manufacturing method for OLED display panel specifically comprising the following steps of:
• Step 1:
• providing an OLED substrate, a cover plate and an encapsulant;
• Step 2:
• removing the release film from one side of the encapsulation colloid;
• Step 3:
• attaching the entirety of the cover plate to the encapsulation colloid at the side with the release film removed;
• Step 4:
• removing the release film from the other side of the encapsulation colloid;
• Step 5:
• patterning the encapsulation colloid of the encapsulant, dividing the encapsulation colloid into a plurality of target encapsulation areas, with each target encapsulation area corresponding to each of the plurality of OLED substrate units, and a gap area outside of the target encapsulation areas, performing disintegration treatment from the other side of the encapsulation colloid on a portion of the encapsulation colloid belonging to the gap area so that the surface of the portion losing adhesiveness;
• Step 6:
• attaching the other side of the encapsulation colloid to the OLED substrate;
• Step 7:
• for each of the plurality of OLED substrate units, cutting the OLED substrate and cover plate bonded to the encapsulation colloid to obtain a plurality of OLED display panels;
• wherein in the step of patterning the encapsulation colloid of the encapsulant, a particle beam bombardment process being used to perform disintegration treatment on the surface of the gap area portion of the encapsulation colloid so that the surface of the portion loses adhesiveness.