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US 2020/0052215 A1Published application
Curable composition and its use for electric device
OwnerJing Zhouinventor
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Abstract
The present invention relates to a curable composition for the sealing, encapsulation, or laminating of electronic devices. The curable compositions according to the invention include those having an aliphatic epoxy resin, an aliphatic oxetane resin and a thermal cure initiator, wherein the compositions provide excellent transparency and good moisture barrier property after cure.
Claims12
1-15. (canceled)
A curable composition, comprising:
- a) an aliphatic epoxy compound,
- b) an aliphatic oxetane compound,
- c) a thermal cure initiator,
- wherein the aliphatic epoxy compound is cycloaliphatic epoxy resin, and
- wherein the aliphatic oxetane compound has the structure of
- wherein R1 is selected from the group consisting of hydrogen, C1 to C12 alkyl, C1 to C12 haloalkyl, C1 to C12 alkoxy and C1 to C12 alkyloyl groups;
- R2 is selected from C1 to C12 alkylene groups;
- R3 is selected from hydrogen, linear C1 to C12 alkyl, branched C3 to C12 alkyl and C5 to C12 cycloalkyl groups, and x is an integer from 1 to 2.
5 more elements
Dependencies are inferred from the claim text.