Interconnection by lateral transfer printing

A method of making a transfer print system, comprising:

• providing a transfer print structure comprising:
• a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate, and
• one or more interconnect structures disposed on and protruding from the destination substrate in a direction orthogonal to the substrate surface, each of the one or more interconnect structures comprising one or more notches, each of the one or more notches (i) having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge of the interconnect structure, (ii) comprising a notch conductor disposed at least partially in the notch and (iii) electrically connected to at least one of the one or more substrate conductors;
• providing one or more electrical components on a source wafer, each electrical component comprising one or more electrically conductive connection posts;
• providing a transfer device;
• contacting the one or more electrical components with the transfer device to remove the one or more electrical components from the source wafer and adhere the one or more electrical components to the transfer device;
• and
• transporting the one or more electrical components to the destination substrate and laterally moving the one or more electrical components over the substrate surface to electrically contact each connection post of the one or more connection posts of each of the one or more electrical components to the notch conductor of a corresponding notch of the one or more notches.