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US 2020/0052173 A1Published application
Led package and led display device
AssigneeRohm Co., Ltd.
InventorsHirotaka Obuchi, Junichi Itai
Life of this patent
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Abstract
An LED package includes a substrate with a front surface and a back surface spaced apart from each other in a thickness direction of the substrate. First and second wirings are formed on the substrate. An LED chip is mounted on the front surface of the substrate and electrically connected to the first and second wirings. A sealing resin, such as silicone, covers the LED chip. The substrate is made up of glass cloths laminated in the thickness direction and an impregnated resin, such as acrylic resin, impregnated in the glass cloths.
Claims17
An LED package, comprising:
- a substrate having a front surface and a back surface that are spaced apart from each other in a thickness direction;
- first wiring and second wiring arranged on the substrate;
- an LED chip mounted on the front surface and electrically connected to the first wiring and the second wiring;
- and
- a sealing resin covering the LED chip, wherein
- the substrate comprises a plurality of glass cloths laminated in the thickness direction and an impregnated resin impregnated in the plurality of glass cloths,
- the impregnated resin comprises acrylic resin, and
- the sealing resin comprises silicone.
5 more elements
Dependencies are inferred from the claim text.