Flexible devices and methods using laser lift-off

A device structure, comprising:

• a rigid substrate;
• a layer of print adhesive disposed on the rigid substrate;
• micro-devices disposed on or in the print adhesive, wherein each micro-device comprises a micro-device substrate separate, independent, and distinct from the rigid substrate and at least a portion of a micro-device tether;
• a bonding layer;
• and
• a flexible substrate bonded to the micro-devices,
• wherein (i) the bonding layer is disposed between the flexible substrate and the micro-devices and (ii) the micro-devices are disposed between the rigid substrate and the flexible substrate, and (iii) the micro-device substrate of each of the micro-devices is separate, independent, and distinct from the flexible substrate.

A flexible device, comprising:

• a flexible substrate;
• a bonding layer;
• micro-devices bonded to the flexible substrate with the bonding layer, wherein each micro-device comprises a micro-device substrate separate, independent, and distinct from the flexible substrate and comprises at least a portion of a micro-device tether, and
• wherein the micro-devices are exposed to the environment.