Pressure-activated electrical interconnection with additive repair

A method of making a repaired electrical connection structure, comprising:

• providing a substrate comprising a first contact pad and a second contact pad electrically connected in parallel with the first contact pad;
• providing one or more component source wafers comprising a first component and a second component functionally identical to the first component;
• disposing a first adhesive layer over and in contact with at least a first portion of the substrate, wherein the first portion is adjacent to, on, or adjacent to and on the first contact pad;
• transferring the first component onto the first adhesive layer so that (i) the first component is in alignment with the first contact pad and (ii) the first adhesive layer contacts at least a portion of the first component between the first component and the substrate;
• testing the first component to determine if the first component is a faulty component;
• and
• if the first component is a faulty component:
• disposing a second adhesive layer over and in contact with at least a second portion of the substrate, wherein the second portion is adjacent to, on, or adjacent to and on the second contact pad, and
• transferring the second component onto the second adhesive layer so that (i) the second component is in alignment with the second contact pad and (ii) the second adhesive layer contacts at least a portion of the second component between the second component and the substrate.