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US 2020/0052023 A1Published application
Solid state imaging device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorYasushi Itabashi
Life of this patent
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Abstract
According to one embodiment, an edge of the second opening is recessed further than an edge of the first opening away from a center of the first opening. The recess has an opening and a concave surface and is disposed in a region inward from the edge of the second opening. The opening has a circular configuration. The concave surface has a curvature.
Claims14
A solid state imaging device, comprising:
- a substrate;
- a pixel provided at a surface of the substrate;
- a first interconnect layer provided on the substrate, the first interconnect layer having a first opening opposing the pixel;
- a second interconnect layer provided on the first interconnect layer, the second interconnect layer having a second opening opposing the first opening;
- and
- an insulating film covering the pixel, the first interconnect layer, and the second interconnect layer and having a plurality of recesses provided in a region opposing the second opening,
- an edge of the second opening being recessed further than an edge of the first opening away from a center of the first opening,
- the recess having an opening and a concave surface and being disposed in a region inward from the edge of the second opening, the opening having a circular configuration, the concave surface having a curvature.
5 more elements
Dependencies are inferred from the claim text.