Light-emitting diodes with light coupling and conversion layers

A method of forming a pixel on a substrate comprising a first light emitting-diode, a second light-emitting diode, and a third light-emitting diode, the method comprising:

• forming a first sub-pixel confinement feature over the first light-emitting diode;
• depositing a first film-forming ink composition comprising curable organic monomers into or onto the first sub-pixel confinement feature over the first light-emitting diode;
• drying the first film-forming ink composition to form a first coupling layer;
• depositing a first quantum dot-containing ink composition comprising red-emitting quantum dots, scattering particles, and curable organic monomers into or onto the first sub-pixel confinement feature;
• drying the first quantum dot-containing ink composition to form a red light-emission layer comprising red-emitting quantum dots and scattering particles disposed in a polymeric matrix;
• forming a second sub-pixel confinement feature over the second light-emitting diode;
• depositing a second film-forming ink composition comprising curable organic monomers into or onto the second sub-pixel confinement feature over the second light-emitting diode;
• drying the second film-forming ink composition to form a second coupling layer;
• depositing a second quantum dot-containing ink composition comprising green-emitting quantum dots, scattering particles, and curable organic monomers into or onto the second sub-pixel confinement feature;
• and
• drying the second quantum dot-containing ink composition to form a green light-emission layer comprising green-emitting quantum dots and scattering particles disposed in a polymeric matrix.

A method of forming a display, the method comprising:

• forming a plurality of pixels on a semiconductor substrate each pixel comprising a red sub-pixel, a green sub-pixel, and a blue sub-pixel, wherein the pixels are formed by:
• forming a first light-emitting diode, a second light-emitting diode, and a third light-emitting diode on the semiconductor substrate;
• forming a first sub-pixel confinement feature over the first light-emitting diode;
• forming a second sub-pixel confinement feature over the second light-emitting diode;
• optionally, forming a third sub-pixel confinement feature over the third light-emitting diode;
• forming a red light emission-layer over the first light-emitting diode in the first pixel confinement feature by depositing an ink composition comprising red-emitting quantum dots into or onto the first pixel confinement feature and drying the ink composition into a solid film to provide the red sub-pixel;
• forming a green light emission layer over the second light-emitting diode in the second pixel confinement feature by depositing an ink composition comprising green-emitting quantum dots into or onto the second pixel confinement feature and drying the ink composition into a solid film to provide the green sub-pixel;
• and
• optionally, forming a blue light emission layer over the third light-emitting diode in the third pixel confinement feature by inkjet depositing an ink composition comprising blue-emitting quantum dots into or onto the blue pixel confinement feature and drying the ink composition into a solid film;
• dicing the substrate into pieces, each of the pieces comprising one or more, but not all, of the pixels;
• and
• transferring one or more of the pieces to a display substrate.