Fine pitch z connections for flip chip memory architectures with interposer
AssigneeIntel Corporation
InventorsOmkar KARHADE, Nitin DESHPANDE, Debendra MALLIK
Life of this patent
Estimating the term…
Abstract
A semiconductor package is disclosed. The semiconductor package includes a package substrate, at least one bottom die coupled to the package substrate, at least one interposer coupled to the package substrate and a top die above the at least one bottom die and the at least one interposer and coupled to the at least one bottom die and the at least one interposer. The semiconductor package also includes a plurality of pillars that connect the top die to the package substrate through the at least one interposer.
Claims20
A semiconductor package, comprising:
- a package substrate;
- at least one bottom die coupled to the package substrate;
- at least one interposer coupled to the package substrate;
- a top die above the at least one bottom die and the at least one interposer and coupled to the at least one bottom die and the at least one interposer;
- and
- a plurality of pillars that connect the top die to the package substrate through the at least one interposer.
A semiconductor package, comprising:
- a package substrate;
- at least one bottom die coupled to the package substrate;
- at least one interposer coupled to the package substrate;
- a top die above the at least one bottom die and the at least one interposer and communicatively coupled to the at least one bottom die and the at least one interposer;
- and
- a plurality of pillars that connect the top die to the package substrate through the interposer.
A method, comprising:
- forming a package substrate;
- forming at least one bottom die and coupling the at least one bottom die to the package substrate;
- forming at least one interposer and coupling the at least one interposer to the package substrate;
- forming a plurality of conductor filled vias in the at least one interposer;
- and
- forming a top die and placing the top die above the at least one bottom die and the at least one interposer and coupling the top die to the at least one bottom die and coupling the top die to the package substrate through the at least one interposer.
Dependencies are inferred from the claim text.