Semiconductor package and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHYOEUN KIM, JI HWANG KIM, JISUN YANG, SEUNGHOON YEON, CHAJEA JO, SANG-UK HAN
Life of this patent
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Abstract
A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.
Claims20
A semiconductor package, comprising:
- a first semiconductor chip;
- a second semiconductor chip on the first semiconductor chip;
- a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other, the second semiconductor chip being interposed between the first semiconductor structure and the second semiconductor structure;
- and
- a resin-containing member interposed between the second semiconductor chip and the first semiconductor structure and interposed between the second semiconductor chip and the second semiconductor structure.
A semiconductor package, comprising:
- a first semiconductor chip;
- a second semiconductor chip mounted on the first semiconductor chip and having a width less than a width of the first semiconductor chip in a given direction;
- a semiconductor die on the first semiconductor chip and including an opening in which the second semiconductor chip is received;
- and
- a resin-containing member interposed between the second semiconductor chip and the semiconductor die.
A semiconductor package, comprising:
- a first semiconductor chip;
- a second semiconductor chip mounted on the first semiconductor chip;
- a third semiconductor chip mounted on the second semiconductor chip and having a width less than a width of the second semiconductor chip in a given direction;
- a semiconductor die on the second semiconductor chip and extending around the third semiconductor chip;
- and
- a resin-containing member interposed between the semiconductor die and the third semiconductor chip.
Dependencies are inferred from the claim text.