Bonding method of semiconductor chip and bonding apparatus of semiconductor chip
AssigneeKabushiki Kaisha Toshiba
InventorYoichiro KURITA
Life of this patent
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Abstract
A bonding method of a first member includes arranging an activated front surface of a first member and an activated front surface of a second member so as to face each other with a back surface of the first member attached to a sheet, pushing a back surface of the first member through the sheet to closely attach the activated front surface of the first member and the activated front surface of the second member, and stripping the sheet from the back surface of the first member while maintaining a state in which the activated front surface of the first member is closely attached to the activated front surface of the second member.
Claims26
A bonding method of a first member comprising:
- arranging an activated front surface of a first member and an activated front surface of a second member so as to face each other with a back surface of the first member attached to a sheet;
- pushing a back surface of the first member through the sheet to closely attach the activated front surface of the first member and the activated front surface of the second member;
- and
- stripping the sheet from the back surface of the first member while maintaining a state in which the activated front surface of the first member is closely attached to the activated front surface of the second member.
Dependencies are inferred from the claim text.